## Grade Comparison
| Grade | Temperature Range | Target Applications | Notes |
| — | — | — | — |
| 4079 | -20 °C to +316 °C | Semiconductor plasma etch, vacuum systems | Low compression set, good plasma resistance |
| Spectrum™ 6375 | -15 °C to +275 °C | Chemical process, amines, steam | Broad chemical compatibility, ideal for mixed streams |
| 7075 | 0 °C to +327 °C | High-temperature chemical loops | High modulus and low compression set for static seals |
| Spectrum™ 6380 | -20 °C to +260 °C | Sour gas, amines, steam | Enhanced amine resistance and mechanical strength |
| 9100 | -15 °C to +300 °C | Semiconductor CVD/etch with low metals | Low particle, ultra-clean formulation |

## Selection Checklist
1. **Process media** – identify acids, amines, solvents, steam, and cleaning agents.
2. **Temperature profile** – include upset conditions, thermal cycling rate, and maximum bake-out temperature.
3. **Seal type** – static vs. dynamic, hardware gap, pressure load, and potential outgassing requirements.
4. **Compliance** – SEMI F57, FDA, USP Class VI, ATEX, oxygen compatibility, or refinery specifications.
5. **Documentation** – confirm manufacturer certificate of analysis, batch traceability, and lot release data.

## Engineering Practices
– Maintain static compression between 15–25 %; consider anti-extrusion rings above 10 MPa differential pressure.
– For dynamic seals, specify 75–80 A hardness and polished hardware (Ra ≤ 0.2 µm).
– Avoid sharp corners in glands; design radii and lead-ins to prevent nicks during installation.
– Pre-bake seals (per manufacturer guidelines) before ultra-clean semiconductor service to reduce outgassing.
– Store sealed packaging below 30 °C and protect from UV; respect Kalrez shelf-life guidance.

## Testing Matrix
| Requirement | Recommended Test | Acceptance |
| — | — | — |
| Chemical compatibility | ASTM D471 immersion in process media | Volume change ≤10 % |
| High-temperature aging | ASTM D573 @ operating peak | Hardness increase ≤10 |
| Compression set | ASTM D395 Method B | ≤30 % at process temperature |
| Plasma resistance | Vendor plasma test (e.g., O₂/CF₄) | Minimal mass loss / cracking |
| Cleanliness | SEMI F57 / ICP-MS metal analysis | Meets tool manufacturer limits |

## Related Resources
– [FFKM Perfluoroelastomer Guide](/materials/ffkm/) – broad overview and alternatives.
– [Design Services](/services/design-services/) – FEA, groove optimisation, validation planning.
– [Custom Manufacturing](/services/custom-manufacturing/) – prototype-to-production with Kalrez supply chain integration.

## Partner With Our Engineering Team
Share your media matrix, thermal envelope, and target launch date through the [FFKM quote form](/quote/ffkm/). A senior applications engineer will respond within one business day with a shortlist of Kalrez® grades, validation plan recommendations, and a procurement roadmap aligned to your schedule.