PTFE O-Rings

PTFE O-Rings | Chemically Inert, Low-Friction Seals

PTFE O-rings provide exceptional chemical inertness and low friction, with a wide range from about -200°C to +260°C. As chemically inert o-rings or low-friction seals, they suit corrosive, clean, and dynamic applications. Low elasticity requires careful groove/fit design.

PTFE O-Rings
PTFE batches and labels
PTFE application sample

What is a PTFE O-ring?

PTFE (polytetrafluoroethylene) O-rings are highly inert, low-friction seals for aggressive chemistry, clean environments, and low-friction dynamics. PTFE encapsulated O-rings with elastomer cores boost elasticity while retaining chemical resistance.

Composition & Properties

If you need both elasticity and chemical resistance, choose FFKM; for low friction plus elasticity, use PTFE encapsulated cores (e.g., silicone/FKM).

  • Low elasticity: pure PTFE lacks rubber elasticity; relies on compression/groove design.
  • Low friction: very low coefficient of friction—great for sliding/dynamic seals.
  • Chemical inertness: stable against most chemicals/solvents with high cleanliness.

Temperature Range

  • Continuous: roughly -200°C to +260°C, depending on formulation/backing.
  • Low temp: remains chemically stable but stiffer—ensure adequate compression or use encapsulated cores.
  • High temp: near upper limit monitor cold flow/compression set.

Chemical Compatibility

  • Suitable: nearly all common chemicals/solvents; corrosive media; clean/food/medical/semiconductor settings.
  • Exceptions: molten alkali metals, some high-energy fluorinated chemicals—verify.
  • Encapsulated: PTFE outer with various cores (silicone/FKM) to add rebound.

Advantages

  • Chemical inertness: handles nearly any medium; clean with minimal extractables.
  • Low friction: ideal for dynamic sliding and anti-stick applications.
  • Wide temperature: from very low to high heat (-200°C to +260°C).
  • Encapsulation option: combines PTFE inertness with elastomeric cores.

Applications

  • Chemical/pharma/food: corrosive and clean media where rubber extractables are a concern.
  • Semiconductor/vacuum: low particle, chemically inert for vacuum and process lines.
  • Dynamic low-friction: valve stems, sliding seals needing low friction and chemical stability.
  • Encapsulated rings: add elasticity to PTFE for broader sealing conditions.

Size Coverage (AS568 / Metric)

  • AS568, metric, large/custom sizes available; pure PTFE or encapsulated options.
  • Compression/extrusion/surface finish guidance based on media/temp/dynamic needs.
  • Batch labeling/color coding for cores if encapsulated.

Ordering & Traceability

  • Confirm media and temperature to choose pure PTFE vs encapsulated; plan critical orders early.
  • Mixed MOQ 1; batch photos/barcodes for traceability.
  • If more elasticity is needed, select encapsulated cores (silicone/FKM/FFKM).

FAQs

  • PTFE vs FFKM: PTFE is more inert but not elastic; FFKM is elastic with high chemical/heat resistance.
  • Low-temp sealing? Needs higher compression or encapsulated core to maintain rebound.
  • Dynamic use? Leverage low friction; control gaps to reduce cold flow/extrusion.
  • Food/clean? PTFE is inherently clean—suitable for food/medical/semiconductor with proper grades.

Installation & Selection Tips

  • Compression: higher than rubber to offset low elasticity; add backup rings for high pressure.
  • Surface: smooth grooves/chamfers (Ra 0.8–1.6 μm) to prevent damage and leakage paths.
  • Storage: clean/dry, avoid scratches; encapsulated cores follow core storage needs.