Semiconductor O-Rings | Ultra-Pure FFKM Plasma Sealing


SEMICONDUCTOR MANUFACTURING

Ultra-Pure Semiconductor
Sealing Solutions

Mission-critical sealing for plasma chambers, etching equipment, and CVD systems. Our FFKM solutions ensure zero contamination with ultra-pure materials validated by the world’s leading semiconductor manufacturers.

<10
ppb Extractables

600°F
Max Temperature

Class 10
Cleanroom Compatible

99.9%
Plasma Resistance

Plasma Chamber Cross-Section

PLASMA

CF₄/CHF₃

Chamber Wall Seals

FFKM Critical

Gas Feed Lines

Ultra-Pure

Pump Port Seals

High Vacuum

Semiconductor Manufacturing Applications

From front-end processing to back-end packaging, our sealing solutions enable the precision and purity required for advanced semiconductor manufacturing.

Plasma Processing Equipment

Critical sealing for plasma etching chambers, RIE systems, and PECVD equipment where aggressive plasma environments demand ultimate material performance.

Etch Chambers
Kalrez 6375
Ion Beam Systems
Kalrez 7075
Plasma CVD
Kalrez 4079

Key Requirements: CF₄/CHF₃/NF₃ resistance, low particle generation, thermal cycling stability

CVD & Deposition Systems

Ultra-pure sealing for chemical vapor deposition, atomic layer deposition, and sputtering systems requiring contamination-free processing.

ALD Chambers
Ultra-Pure FFKM
MOCVD Systems
High-Temp FFKM
Sputter Tools
Low Outgassing

Key Requirements: Ultra-low extractables (<10 ppb), high-temperature stability, metal contamination control

Lithography & Metrology

Precision sealing for lithography steppers, immersion systems, and metrology equipment where dimensional stability is critical.

Immersion Systems
DI Water Compatible
EUV Scanners
Ultra-High Vacuum
Metrology Tools
Dimensional Stability

Key Requirements: Chemical compatibility with photoresists and solvents, precision tolerances

Supported Equipment Types

Etching Equipment

• Reactive Ion Etchers (RIE)
• Deep RIE (DRIE) Systems
• Ion Beam Etchers
• Plasma Ashers
• Wet Etching Systems

Deposition Tools

• ALD Chambers
• PECVD Reactors
• MOCVD Systems
• Sputter Coaters
• E-beam Evaporators

Thermal Processing

• RTP Systems
• Diffusion Furnaces
• Oxidation Furnaces
• Annealing Systems
• LPCVD Furnaces

Analytical Equipment

• SEM Chambers
• XPS Systems
• Mass Spectrometers
• Ion Beam Tools
• Vacuum Chambers

Advanced Materials Technology

Our semiconductor-grade FFKM materials are engineered specifically for the demanding requirements of leading-edge chip manufacturing.

Semiconductor-Grade Material Properties

Validated by Fortune 500 semiconductor manufacturers

Property Test Method Kalrez 6375 Kalrez 7075 Kalrez 8575
Extractables (DI Water) SEMI F57 < 5 ppb < 3 ppb < 1 ppb
Particle Generation IEST-RP-CC001 Class 10 Class 1 Class 1
Plasma Resistance (CF₄) ASTM F1058 Excellent Superior Ultimate
Temperature Range Continuous Service -15°F to 600°F -40°F to 550°F -65°F to 500°F
Metal Content (Al, Na, K) ICP-MS < 10 ppb each < 5 ppb each < 1 ppb each

Plasma Gas Compatibility

Carbon Tetrafluoride (CF₄)
Primary etching gas

Excellent

Trifluoromethane (CHF₃)
Oxide etching

Excellent

Nitrogen Trifluoride (NF₃)
Chamber cleaning

Excellent

Sulfur Hexafluoride (SF₆)
Silicon etching

Very Good

Oxygen Plasma (O₂)
Resist stripping

Excellent

Contamination Control

Metal Contamination (ppb)

Aluminum (Al)

< 1 ppb

Sodium (Na)

< 1 ppb

Potassium (K)

< 1 ppb

Iron (Fe)

< 2 ppb

Particle Performance

Particle Size > 0.1 μm
< 10/m³
Particle Size > 0.5 μm
< 1/m³
Tested per IEST-RP-CC001

Semiconductor ROI Analysis

Quantify the business impact of superior sealing performance in your semiconductor manufacturing operations.

Cost Impact Calculator

$
Average etch chamber value

$
Including lost wafer production




Annual Cost Analysis

Current State (Standard FKM)

Seal Failures per Year:
20 events
Downtime Hours:
480 hours
Lost Production Cost:
$7,200,000
Material Costs:
$50,000
Total Annual Cost:
$7,250,000

With FFKM Upgrade

Seal Failures per Year:
2 events
Downtime Hours:
48 hours
Lost Production Cost:
$720,000
Material Costs:
$150,000
Total Annual Cost:
$870,000

Annual Savings

Total Savings:
$6,380,000
ROI on Material Upgrade:
6,380%
Payback Period:
5.7 days

Get Your Semiconductor Sealing Quote

Our semiconductor specialists understand your critical requirements. Get a detailed technical proposal with material certifications and contamination analysis within 24 hours.

Technical Requirements








🔒 All technical information is confidential and protected

Your Quote Package Includes

Material Certification Package

Complete extractables analysis, contamination reports, and SEMI standard compliance documentation.

24-Hour Technical Response

Priority handling by our semiconductor specialists with detailed material recommendations.

ROI Cost Analysis

Detailed downtime cost analysis showing potential savings from seal reliability improvements.

Free Evaluation Samples

Qualified samples for testing in your equipment with full technical support.

Trusted by Industry Leaders

500+
Semiconductor Fabs

15+
Years Experience

Validated by Fortune 500 equipment manufacturers

Plan Your Program

Coordinate supply, QA, and compliance across your global sites.

Plan Your Program

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